ROM/PROM

Technical Characteristics

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Inclosure Configuration

  flat pack

• Memory Device Type

  pal

• Body Width

  0.679 inches maximum

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Inclosure Material

  ceramic

• Features Provided

  monolithic and programmable

• Body Height

  0.145 inches maximum

• Body Length

  0.679 inches maximum