ROM/PROM

Technical Characteristics

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Body Length

  0.442 inches minimum and 0.458 inches maximum

• Voltage Rating And Type Per Characteristic

  -0.5 volts minimum power source and 7.0 volts maximum power source

• Memory Device Type

  prom

• Body Height

  0.064 inches minimum and 0.100 inches maximum

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Time Rating Per Chacteristic

  50.00 nanoseconds maximum propagation delay time, low to high level output and 50.00 nanoseconds maximum propagation delay time, high to low level output

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Body Width

  0.442 inches minimum and 0.458 inches maximum

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Inclosure Configuration

  leadless flat pack

• Terminal Type And Quantity

  28 leadless

• Inclosure Material

  ceramic

• Terminal Surface Treatment

  solder

• Maximum Power Dissipation Rating

  413.0 milliwatts

• Features Provided

  programmable and hermetically sealed and burn in and high performance

• Word Quantity (Non-Core)

  2048

• Input Circuit Pattern

  14 input

• Bit Quantity (Non-Core)

  16384