X2212M

Technical Characteristics

• Body Width

  0.220 inches minimum and 0.310 inches maximum

• Body Height

  0.130 inches minimum and 0.185 inches maximum

• Inclosure Material

  ceramic

• Output Logic Form

  n-type metal oxide-semiconductor logic

• Bit Quantity

  1024

• Case Outline Source And Designator

  d-6 mil-m-38510

• Terminal Surface Treatment

  solder

• ~1

  300.00 nanoseconds maximum propagation delay time, high to low level output

• Memory Device Type

  ram

• Unpackaged Unit Weight

  3.0 grams

• Test Data Document

  96906-mil-std-883 standard

• Terminal Type And Quantity

  18 printed circuit

• Body Length

  0.960 inches maximum

• Maximum Power Dissipation Rating

  500.0 milliwatts

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Features Provided

  hermetically sealed and burn in and monolithic and positive outputs

• Inclosure Configuration

  dual-in-line

• Input Circuit Pattern

  15 input

• Word Quantity

  256

• Voltage Rating And Type Per Characteristic

  7.0 volts maximum power source

• Time Rating Per Chacteristic

  300.00 nanoseconds maximum propagation delay time, low to high level output and