ROM/PROM

Technical Characteristics

• Inclosure Material

  ceramic

• Terminal Surface Treatment

  solder

• Overall Length

  1.290 inches maximum

• Overall Height

  0.425 inches maximum

• Inclosure Configuration

  dual-in-line

• Word Quantity (Non-Core)

  2048

• Terminal Type And Quantity

  24 printed circuit

• Input Circuit Pattern

  14 input

• Body Length

  1.290 inches maximum

• Bit Quantity (Non-Core)

  16384

• Maximum Power Dissipation Rating

  1.02 watts

• Output Logic Form

  transistor-transistor logic

• Case Outline Source And Designator

  d-3 mil-m-38510

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Memory Device Type

  prom

• Features Provided

  3-state output and high impedance and w/active pull-up and bipolar and schottky and monolithic and programmed

• Voltage Rating And Type Per Characteristic

  -0.5 volts minimum power source and 7.0 volts maximum power source

• Body Height

  0.150 inches minimum and 0.210 inches maximum

• Current Rating Per Characteristic

  185.00 milliamperes reverse current, dc absolute

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Time Rating Per Chacteristic

  100.00 nanoseconds maximum propagation delay time, high to low level output and 100.00 nanoseconds maximum propagation delay time, low to high level output

• Body Width

  0.500 inches minimum and 0.610 inches maximum