GM820AUF1RN1

Technical Characteristics

• Body Width

  0.515 inches minimum and 0.600 inches maximum

• Bit Quantity (Non-Core)

  16384

• Current Rating Per Characteristic

  115.00 milliamperes reverse current, dc absolute

• Output Logic Form

  n-type metal oxide-semiconductor logic

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Body Length

  1.285 inches maximum

• Unpackaged Unit Weight

  6.5 grams

• Body Height

  0.217 inches maximum

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Inclosure Material

  ceramic

• Terminal Surface Treatment

  solder

• Time Rating Per Chacteristic

  450.00 nanoseconds maximum access

• Overall Height

  0.357 inches nominal

• Voltage Rating And Type Per Characteristic

  -300.0 millivolts minimum input and 6.0 volts maximum input

• Capitance Rating Per Characteristic

  6.00 input pascal dense structural 65 and 12.00 output pascal dense structural 65

• Memory Device Type

  eprom

• Inclosure Configuration

  dual-in-line

• Word Quantity (Non-Core)

  2048

• Maximum Power Dissipation Rating

  633.0 milliwatts

• Input Circuit Pattern

  13 input

• Terminal Type And Quantity

  24 printed circuit

• Features Provided

  ultraviolet erasable and hermetically sealed and burn in and programmable