588R477H01

Technical Characteristics

• Overall Width

  1.160 inches maximum

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Bit Quantity (Non-Core)

  65536

• Inclosure Configuration

  flat pack

• Case Outline Source And Designator

  f-12 mil-m-38510

• Time Rating Per Chacteristic

  350.00 nanoseconds maximum access

• Body Height

  0.090 inches minimum and 0.130 inches maximum

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Word Quantity (Non-Core)

  8192

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Inclosure Material

  ceramic

• Maximum Power Dissipation Rating

  1.0 watts

• Terminal Surface Treatment

  solder

• Input Circuit Pattern

  24 input

• Overall Height

  0.090 inches minimum and 0.130 inches maximum

• Features Provided

  programmable and hermetically sealed and burn in and electrostatic sensitive and erasable

• Overall Length

  0.740 inches maximum

• Capitance Rating Per Characteristic

  err-060 maximum and err-060 maximum

• Memory Device Type

  eeprom

• Body Width

  0.380 inches minimum and 0.420 inches maximum

• Current Rating Per Characteristic

  45.00 milliamperes reverse current, dc absolute

• Voltage Rating And Type Per Characteristic

  -0.3 volts minimum power source and 6.25 volts maximum power source

• Body Length

  0.740 inches maximum