SG0805BX103JPA

Technical Characteristics

• Overall Width

  0.040 inches minimum and 0.060 inches maximum

• Precious Material

  palladium and silver

• Dissipation Factor At Reference Temp In Percent

  2.500

• Terminal Surface Treatment

  palladium and silver

• Body Style

  chip type

• Nonderated Continuous Voltage Rating And Type Per Section

  50.0 dc single section

• Case Material

  ceramic

• Tolerance Range Per Section

  -5.00/+5.00 percent single section

• Body Height

  0.050 inches maximum

• Terminal Type And Quantity

  2 bonding pad

• Overall Height (Non-Core)

  0.050 inches maximum

• Reliability Indicator

  not established

• Capacitance Value Per Section

  10000.000 picofarads single section

• Voltage Temp Limits Per Section In Percent Capacitance Change

  -15.0/+15.0 without voltage applied single section

• Terminal Length

  0.010 inches minimum

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Body Length

  0.070 inches minimum and 0.090 inches maximum

• Overall Length

  0.070 inches minimum and 0.090 inches maximum

• Precious Material And Location

  terminal surfaces palladium and terminal surfaces silver

• Insulation Resistance At Reference Temp

  100000.0 megohms

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Body Width

  0.040 inches minimum and 0.060 inches maximum