1209B104J2P

Technical Characteristics

• Terminal Type And Quantity

  2 bonding pad

• Insulation Resistance At Maximum Operating Temp

  100.0 megohm-microfarads

• Body Length

  0.115 inches minimum and 0.135 inches maximum

• Insulation Resistance At Reference Temp

  1000.0 megohm-microfarads

• Voltage Temp Limits Per Section In Percent Capacitance Change

  -25.0/+15.0 without voltage applied single section

• Body Height

  0.065 inches maximum

• Terminal Length

  0.020 inches minimum and 0.040 inches maximum

• Reliability Indicator

  not established

• Body Width

  0.085 inches minimum and 0.105 inches maximum

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Capacitance Value Per Section

  0.100 microfarads single section

• Overall Length

  0.115 inches minimum and 0.135 inches maximum

• Precious Material And Location

  terminal surfaces palladium and terminal surfaces silver

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Precious Material

  palladium and silver

• Dissipation Factor At Reference Temp In Percent

  2.500

• Terminal Surface Treatment

  palladium and silver

• Overall Width

  0.085 inches minimum and 0.105 inches maximum

• Body Style

  chip type

• Nonderated Continuous Voltage Rating And Type Per Section

  50.0 dc single section

• Overall Height (Non-Core)

  0.065 inches maximum

• Case Material

  ceramic

• Tolerance Range Per Section

  -5.00/+5.00 percent single section