ROM/PROM

Technical Characteristics

• Memory Device Type

  pal

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Body Length

  1.280 inches maximum

• Maximum Power Dissipation Rating

  1.2 watts

• Terminal Type And Quantity

  24 printed circuit

• Inclosure Configuration

  dual-in-line

• Case Outline Source And Designator

  d-9 mil-m-38510

• Overall Length

  1.280 inches maximum

• Terminal Surface Treatment

  solder

• Overall Height

  0.400 inches maximum

• Inclosure Material

  ceramic

• Body Width

  0.220 inches minimum and 0.310 inches maximum

• Current Rating Per Characteristic

  100.00 milliamperes maximum supply

• Features Provided

  burn in and hermetically sealed and monolithic and programmable

• Time Rating Per Chacteristic

  40.00 nanoseconds maximum propagation delay

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Body Height

  0.140 inches minimum and 0.185 inches maximum

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Capitance Rating Per Characteristic

  5.00 input picofarads maximum and 8.00 output picofarads maximum

• Input Circuit Pattern

  22 input

• Voltage Rating And Type Per Characteristic

  -0.5 volts minimum power source and 7.0 volts maximum power source

• Part Name Assigned By Controlling Agency

  and-or-logic array