ROM/PROM

Technical Characteristics

• Storage Temp Range

  -65.0 to 150.0 deg celsius

• Features Provided

  burn in and

• Features Provided

  monolithic and

• Features Provided

  programmed

• Inclosure Material

  ceramic

• Inclosure Configuration

  leadless flat pack

• Case Outline Source And Designator

  c-2 mil-m-38510

• Terminal Surface Treatment

  solder

• Part Name Assigned By Controlling Agency

  microcircuit,digital,and-or invert gate array

• Voltage Rating And Type Per Characteristic

  -0.5 volts minimum power source and

• Voltage Rating And Type Per Characteristic

  7.0 volts maximum power source

• Memory Device Type

  pal

• Terminal Type And Quantity

  20 leadless

• Body Length

  0.342 inches minimum and

• Body Length

  0.358 inches maximum

• Body Width

  0.342 inches minimum and

• Body Width

  0.358 inches maximum

• Body Height

  0.060 inches minimum and

• Body Height

  0.100 inches maximum

• Maximum Power Dissipation Rating

  1.2 watts

• Operating Temp Range

  -55.0 to 125.0 deg celsius

• Features Provided

  electrostatic sensitive and

• Output Logic Form

  transistor-transistor logic

• Input Circuit Pattern

  16 input

• Test Data Document

  96906-mil-std-883 standard