ROM/PROM

Technical Characteristics

• Terminal Surface Treatment

  solder

• Case Outline Source And Designator

  c-2 mil-m-38510

• Body Length

  0.342 inches minimum and 0.358 inches maximum

• Body Height

  0.060 inches minimum and 0.100 inches maximum

• Voltage Rating And Type Per Characteristic

  -0.5 volts minimum power source and 12.0 volts maximum power source

• Memory Device Type

  pal

• Body Width

  0.342 inches minimum and 0.358 inches maximum

• Features Provided

  bipolar and burn in and electrostatic sensitive and monolithic and programmed

• Maximum Power Dissipation Rating

  1.1 watts

• Terminal Type And Quantity

  20 leadless

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Inclosure Configuration

  leadless flat pack

• Part Name Assigned By Controlling Agency

  microcircuit,digital,programmed pal,and/or invert gate array

• Inclosure Material

  ceramic

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Input Circuit Pattern

  16 input