ROM/PROM

Technical Characteristics

• Features Provided

  hermetically sealed and burn in and monolithic and positive outputs

• Case Outline Source And Designator

  f-9 mil-m-38510

• Maximum Power Dissipation Rating

  303.0 milliwatts

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Input Circuit Pattern

  10 input

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Inclosure Material

  ceramic

• Terminal Surface Treatment

  solder

• Inclosure Configuration

  dual-in-line

• Body Height

  0.045 inches minimum and 0.100 inches maximum

• Time Rating Per Chacteristic

  50.00 nanoseconds maximum delay

• Output Logic Form

  transistor-transistor logic

• Current Rating Per Characteristic

  55.00 milliamperes reverse current, dc absolute

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Memory Device Type

  pal

• Part Name Assigned By Controlling Agency

  and-or-invert gate array

• Body Length

  0.540 inches maximum

• End Item Identification

  5895-01-299-3419 converter,signal data

• Terminal Type And Quantity

  20 flat leads

• Body Width

  0.245 inches minimum and 0.300 inches maximum

• Voltage Rating And Type Per Characteristic

  -0.5 volts minimum power source and 7.0 volts maximum power source