SG1812BX224JPA

Technical Characteristics

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Insulation Resistance At Reference Temp

  100000.0 megohms

• Precious Material And Location

  terminal surfaces palladium and terminal surfaces silver

• Overall Length

  0.115 inches minimum and 0.135 inches maximum

• Body Width

  0.090 inches minimum and 0.110 inches maximum

• Overall Width

  0.090 inches minimum and 0.110 inches maximum

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Terminal Length

  0.010 inches minimum

• Voltage Temp Limits Per Section In Percent Capacitance Change

  -15.0/+15.0 without voltage applied single section

• Capacitance Value Per Section

  220000.000 picofarads single section

• Overall Height (Non-Core)

  0.075 inches maximum

• Reliability Indicator

  not established

• Body Length

  0.115 inches minimum and 0.135 inches maximum

• Body Height

  0.075 inches maximum

• Terminal Type And Quantity

  2 bonding pad

• Tolerance Range Per Section

  -5.00/+5.00 percent single section

• Case Material

  ceramic

• Nonderated Continuous Voltage Rating And Type Per Section

  50.0 dc single section

• Body Style

  chip type

• Terminal Surface Treatment

  palladium and silver

• Dissipation Factor At Reference Temp In Percent

  2.500

• Precious Material

  palladium and silver