ROM/PROM

Technical Characteristics

• Inclosure Configuration

  flat pack

• Terminal Type And Quantity

  24 flat leads

• Time Rating Per Chacteristic

  40.00 nanoseconds maximum access

• Features Provided

  electrostatic sensitive and burn in and hermetically sealed and monolithic

• Memory Device Type

  prom

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Body Length

  0.640 inches maximum

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Inclosure Material

  ceramic

• Terminal Surface Treatment

  solder

• Bit Quantity (Non-Core)

  32768

• Word Quantity (Non-Core)

  4096

• Body Height

  0.045 inches minimum and 0.090 inches maximum

• Capitance Rating Per Characteristic

  15.00 input picofarads maximum and 12.00 output picofarads maximum

• Input Circuit Pattern

  14 input

• Output Logic Form

  transistor-transistor logic

• Current Rating Per Characteristic

  190.00 milliamperes reverse current, dc absolute

• Case Outline Source And Designator

  f-6 mil-m-38510

• Maximum Power Dissipation Rating

  1.04 watts

• Body Width

  0.300 inches minimum and 0.420 inches maximum

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Voltage Rating And Type Per Characteristic

  -0.3 volts minimum power source and 7.0 volts maximum power source