ROM/PROM

Technical Characteristics

• Inclosure Configuration

  flat pack

• Part Name Assigned By Controlling Agency

  registered and-or gate array

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Output Logic Form

  transistor-transistor logic

• Input Circuit Pattern

  14 input

• Body Height

  0.045 inches minimum and 0.100 inches maximum

• Maximum Power Dissipation Rating

  600.0 milliwatts

• Terminal Surface Treatment

  solder

• Current Rating Per Characteristic

  105.00 milliamperes reverse current, dc absolute

• Inclosure Material

  ceramic

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Time Rating Per Chacteristic

  30.00 nanoseconds maximum delay

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Case Outline Source And Designator

  f-9 mil-m-38510

• Special Features

  nuclear hardness critical items

• Voltage Rating And Type Per Characteristic

  -0.5 volts minimum power source and 7.0 volts maximum power source

• Body Width

  0.245 inches minimum and 0.300 inches maximum

• Terminal Type And Quantity

  20 flat leads

• Body Length

  0.540 inches maximum

• Features Provided

  hermetically sealed and monolithic and burn in and electrostatic sensitive

• Nuclear Hardness Critical Feature

  hardened

• Memory Device Type

  pal