74D041110-2009

Microcircuits, Electronic

MICROCIRCUIT,MEMORY

74D041110-2009

5962-01-354-8416

5962 - Microcircuits, Electronic

Boeing Company The

MICROCIRCUIT,MEMORY

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Technical Characteristics

  • Inclosure Configuration

    dual-in-line

  • Case Outline Source And Designator

    d-9 mil-m-38510

  • Terminal Surface Treatment

    solder

  • Inclosure Material

    ceramic

  • Body Width

    0.220 inches minimum and 0.310 inches maximum

  • Storage Temp Range

    -65.0/+150.0 deg celsius

  • Test Data Document

    96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

  • Features Provided

    bipolar and burn in and programmed

  • Input Circuit Pattern

    22 input

  • Voltage Rating And Type Per Characteristic

    -0.5 volts minimum power source and 7.0 volts maximum power source

  • Body Height

    0.185 inches maximum

  • Memory Device Type

    pal

  • Operating Temp Range

    -55.0/+125.0 deg celsius

  • Body Length

    1.280 inches maximum

  • Maximum Power Dissipation Rating

    1.2 watts

  • Terminal Type And Quantity

    24 printed circuit

Certified to
AS6081 Methods

Implementing Quality Procurement

A rigorous vendor selection process and vendor management system are essential to ensuring quality.
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Supplying Quality Products

We take every measure to ensure that we supply quality, authentic parts including a strict vendor selection process and rigorous product inspections..
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Providing Quality People

Our team of dedicated account managers, procurement professionals and specialized inspectors is the most valuable resource we have.
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