ROM/PROM

Technical Characteristics

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Inclosure Configuration

  leadless flat pack

• Inclosure Material

  ceramic

• Part Name Assigned By Controlling Agency

  and-or array

• Terminal Surface Treatment

  solder

• Case Outline Source And Designator

  c-2 mil-m-38510

• Body Length

  0.342 inches minimum and 0.358 inches maximum

• Overall Length

  0.342 inches minimum and 0.358 inches maximum

• Body Height

  0.060 inches minimum and 0.100 inches maximum

• Overall Height

  0.060 inches minimum and 0.100 inches maximum

• Maximum Power Dissipation Rating

  1.5 watts

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Memory Device Type

  pal

• Overall Width

  0.342 inches minimum and 0.358 inches maximum

• Current Rating Per Characteristic

  130.00 milliamperes reverse current, dc absolute

• Body Width

  0.342 inches minimum and 0.358 inches maximum

• Input Circuit Pattern

  18 input

• Voltage Rating And Type Per Characteristic

  -0.5 volts minimum power source and 7.0 volts maximum power source

• Terminal Type And Quantity

  20 leadless

• Features Provided

  electrostatic sensitive and bidirectional and monolithic and programmable