205-0059-001

Microcircuits, Electronic

MICROCIRCUIT ASSEMBLY

205-0059-001

5962-01-356-6553

5962 - Microcircuits, Electronic

Dpac Technologies Corp.

MICROCIRCUIT ASSEMBLY

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Technical Characteristics

  • Features Provided

    radiation hardened and hermetically sealed and burn in and static operation

  • Terminal Surface Treatment

    solder all memory

  • Output Logic Form

    complementary-metal oxide-semiconductor logic all memory

  • Inclosure Material

    ceramic all memory

  • Body Length

    0.999 inches nominal

  • Body Width

    0.999 inches nominal

  • Microcircuit Device Type And Quantity

    4 memory

  • Memory Device Type

    ram all memory

  • Test Data Document

    96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

  • Body Height

    0.170 inches nominal

  • Special Features

    nuclear hardness critical items

  • Terminal Type And Quantity

    31 pin all memory

  • Nuclear Hardness Critical Feature

    hardened

  • Operating Temp Range

    -55.0/+125.0 deg celsius

  • Word Quantity (Non-Core)

    1024 all memory

  • Bit Quantity (Non-Core)

    4096 all memory

Certified to
AS6081 Methods

Implementing Quality Procurement

A rigorous vendor selection process and vendor management system are essential to ensuring quality.
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Supplying Quality Products

We take every measure to ensure that we supply quality, authentic parts including a strict vendor selection process and rigorous product inspections..
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Providing Quality People

Our team of dedicated account managers, procurement professionals and specialized inspectors is the most valuable resource we have.
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