5962-8684603XB

Technical Characteristics

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Inclosure Material

  ceramic

• Maximum Power Dissipation Rating

  1.0 watts

• Terminal Surface Treatment

  solder

• Capitance Rating Per Characteristic

  7.00 input picofarads maximum and 7.00 output picofarads maximum

• Input Circuit Pattern

  9 input

• Body Height

  0.045 inches minimum and 0.092 inches maximum

• Memory Device Type

  first-in first-out

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Word Quantity (Non-Core)

  64

• Case Outline Source And Designator

  f-10 mil-m-38510

• Inclosure Configuration

  flat pack

• Terminal Type And Quantity

  18 flat leads

• Current Rating Per Characteristic

  90.00 milliamperes reverse current, dc absolute

• Body Length

  0.540 inches maximum

• Voltage Rating And Type Per Characteristic

  -0.5 volts minimum power source and 7.0 volts maximum power source

• Body Width

  0.250 inches minimum and 0.370 inches maximum

• Features Provided

  burn in and monolithic and hermetically sealed and parallel operation

• Time Rating Per Chacteristic

  55.00 nanoseconds maximum delay

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Bit Quantity (Non-Core)

  320