XC3090-100PG175B

Technical Characteristics

• Body Length

  1.660 inches nominal

• Storage Temp Range

  -65.0/+150.0 deg celsius

• ~1

  ink

• Inclosure Configuration

  dual-in-line

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Current Rating Per Characteristic

  15.00 milliamperes maximum supply

• Terminal Surface Treatment

  solder

• Part Name Assigned By Controlling Agency

  high density (9,000 gate) programmable gate array

• Voltage Rating And Type Per Characteristic

  0.5 volts minimum power source and 7.0 volts maximum power source

• Time Rating Per Chacteristic

  100.00 nanoseconds maximum delay

• Terminal Type And Quantity

  198 pin

• Test Data Document

  96906-mil-std-883 standard

• Memory Device Type

  pal

• Inclosure Material

  ceramic

• Features Provided

  hermetically sealed and burn in and monolithic and positive outputs and w/heat s

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Body Height

  0.105 inches nominal

• Body Width

  1.660 inches nominal