AQ14BP2R0BUZ

Technical Characteristics

• Terminal Type And Quantity

  2 bonding pad

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  -30.0/+30.0 single section

• Terminal Surface Treatment

  solder

• Reliability Indicator

  not established

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Body Height

  0.030 inches minimum and 0.102 inches maximum

• Overall Width

  0.090 inches minimum and 0.130 inches maximum

• Capacitance Value Per Section

  2.000 picofarads single section

• Body Width

  0.090 inches minimum and 0.130 inches maximum

• Dissipation Factor At Reference Temp In Percent

  0.150

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Insulation Resistance At Maximum Operating Temp

  100000.0 megohms

• Overall Length

  0.090 inches minimum and 0.145 inches maximum

• Case Material

  ceramic or glass

• Body Length

  0.090 inches minimum and 0.145 inches maximum

• Tolerance Range Per Section

  -0.10/+0.10 picofarads single section

• Nonderated Continuous Voltage Rating And Type Per Section

  500.0 dc single section

• Overall Height

  0.030 inches minimum and 0.102 inches maximum

• Body Style

  chip type

• Terminal Length

  0.005 inches minimum and 0.025 inches maximum

• Insulation Resistance At Reference Temp

  1000000.0 megohms

• Temp Coefficient Of Capacitance Per Section In Ppm Per Deg Celsius

  0.0 single section