5962-8986303XB

Technical Characteristics

• Memory Device Type

  first-in first-out

• Body Width

  0.500 inches minimum and 0.610 inches maximum

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Current Rating Per Characteristic

  130.00 milliamperes reverse current, dc absolute

• Voltage Rating And Type Per Characteristic

  -0.5 volts minimum power source and 7.0 volts maximum power source

• Body Length

  1.490 inches maximum

• Body Height

  0.217 inches maximum

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Features Provided

  monolithic and burn in and hermetically sealed and positive outputs

• Bit Quantity (Non-Core)

  512

• Part Name Assigned By Controlling Agency

  parallel 512 x 9 fifo

• Inclosure Material

  ceramic

• Maximum Power Dissipation Rating

  1.0 watts

• Terminal Surface Treatment

  solder

• Capitance Rating Per Characteristic

  8.00 input picofarads maximum and 8.00 output picofarads maximum

• Terminal Type And Quantity

  28 printed circuit

• Case Outline Source And Designator

  d-10 mil-m-38510

• Inclosure Configuration

  dual-in-line

• Time Rating Per Chacteristic

  50.00 nanoseconds maximum access

• Word Quantity (Non-Core)

  512