ROM/PROM

Technical Characteristics

• Body Width

  0.310 inches maximum

• Body Height

  0.100 inches maximum

• Case Outline Source And Designator

  c-2 mil-m-38510

• Part Name Assigned By Controlling Agency

  microcircuits, digital, bipolar, programmable logic, monolithic silicon

• Terminal Surface Treatment

  solder

• Inclosure Material

  ceramic

• Inclosure Configuration

  leadless flat pack

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Terminal Type And Quantity

  20 leadless

• Maximum Power Dissipation Rating

  303.0 milliwatts

• Current Rating Per Characteristic

  1.00 milliamperes maximum input

• Voltage Rating And Type Per Characteristic

  -0.5 volts minimum power source and 7.0 volts maximum power source

• Features Provided

  monolithic and burn in and bipolar and programmed

• Memory Device Type

  pal

• Input Circuit Pattern

  16 input

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Body Length

  0.358 inches maximum

• Output Logic Form

  bipolar metal-oxide semiconductor