ROM/PROM

Technical Characteristics

• Inclosure Material

  ceramic

• Maximum Power Dissipation Rating

  1.0 watts

• Terminal Surface Treatment

  solder

• Body Length

  11.23 millimeters minimum and 11.68 millimeters maximum

• Memory Device Type

  eprom

• Input Circuit Pattern

  14 input

• Case Outline Source And Designator

  c-4 mil-m-38510

• Time Rating Per Chacteristic

  45.00 nanoseconds maximum access

• Body Width

  11.23 millimeters minimum and 11.68 millimeters maximum

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Bit Quantity (Non-Core)

  65536

• Current Rating Per Characteristic

  120.00 milliamperes reverse current, dc absolute

• Voltage Rating And Type Per Characteristic

  -0.5 volts minimum power source and 7.0 volts maximum power source

• Features Provided

  burn in and monolithic and programmed

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Word Quantity (Non-Core)

  8192

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Body Height

  1.52 millimeters minimum and 2.54 millimeters maximum

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Inclosure Configuration

  leadless flat pack

• Terminal Type And Quantity

  28 leadless