ROM/PROM
Microcircuits, Electronic
MICROCIRCUIT,MEMORY
ROM/PROM
5962 - Microcircuits, Electronic
MICROCIRCUIT,MEMORY
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Technical Characteristics
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Inclosure Configuration
flat pack
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Memory Device Type
pal
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Body Length
0.540 inches maximum
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Terminal Type And Quantity
20 flat leads
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Body Width
0.245 inches minimum and 0.300 inches maximum
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Features Provided
hermetically sealed and monolithic and programmed and burn in and electrostatic sensitive
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Voltage Rating And Type Per Characteristic
-0.5 volts minimum power source and 7.0 volts maximum power source
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Maximum Power Dissipation Rating
1.1 watts
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Case Outline Source And Designator
f-9 mil-m-38510
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Test Data Document
96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).
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Storage Temp Range
-65.0/+150.0 deg celsius
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Inclosure Material
ceramic
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Terminal Surface Treatment
solder
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Body Height
0.045 inches minimum and 0.100 inches maximum
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Input Circuit Pattern
14 input
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Output Logic Form
transistor-transistor logic
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Current Rating Per Characteristic
190.00 milliamperes reverse current, dc absolute
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Time Rating Per Chacteristic
20.00 nanoseconds maximum delay
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Operating Temp Range
-55.0/+125.0 deg celsius
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Part Name Assigned By Controlling Agency
registered and-or gate array