1026N101K401N

Technical Characteristics

• Reliability Indicator

  not established

• Dissipation Factor At Reference Temp In Percent

  0.100

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Tolerance Range Per Section

  -10.00/+10.00 percent single section

• Overall Width (Non-Core)

  0.060 inches nominal

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Insulation Resistance At Maximum Operating Temp

  100000.0 megohms

• Capacitance Value Per Section

  100.000 picofarads single section

• Body Height

  0.060 inches nominal

• Overall Length (Non-Core)

  0.125 inches nominal

• Terminal Type And Quantity

  2 bonding pad

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  -30.0/+30.0 single section

• Terminal Surface Treatment

  solder

• Body Length

  0.125 inches nominal

• Case Material

  ceramic

• Nonderated Continuous Voltage Rating And Type Per Section

  400.0 dc single section

• Temp Coefficient Of Capacitance Per Section In Ppm Per Deg Celsius

  0.0 single section

• Insulation Resistance At Reference Temp

  1000000.0 megohms

• Overall Height (Non-Core)

  0.060 inches nominal

• Body Width

  0.060 inches nominal

• Body Style

  chip type