ROM/PROM

Technical Characteristics

• Features Provided

  hermetically sealed and programmed and burn in and monolithic and electrostatic sensitive

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Current Rating Per Characteristic

  180.00 milliamperes reverse current, dc absolute

• Memory Device Type

  pal

• Body Length

  0.442 inches minimum and 0.460 inches maximum

• Voltage Rating And Type Per Characteristic

  -0.5 volts minimum power source and 7.0 volts maximum power source

• Input Circuit Pattern

  22 input

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Time Rating Per Chacteristic

  30.00 nanoseconds maximum delay

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Body Width

  0.442 inches minimum and 0.460 inches maximum

• Inclosure Configuration

  leadless flat pack

• Terminal Type And Quantity

  28 leadless

• Inclosure Material

  ceramic

• Terminal Surface Treatment

  solder

• Maximum Power Dissipation Rating

  1.2 watts

• Part Name Assigned By Controlling Agency

  registerd and-or logic array

• Case Outline Source And Designator

  c-4 mil-m-38510

• Output Logic Form

  transistor-transistor logic

• Body Height

  0.060 inches minimum and 0.100 inches maximum