ROM/PROM

Technical Characteristics

• Inclosure Configuration

  flat pack

• Bit Quantity (Non-Core)

  2000

• Memory Device Type

  prom

• Features Provided

  programmed

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Case Outline Source And Designator

  f-6 mil-m-38510

• Test Data Document

  49956-g504229 drawing (this is the basic governing drawing, such as a contractor drawing, original equipment manufacturer drawing, etc.; excludes any specification, standard or other document that may be referenced in a basic governing drawing)

• Specification/Standard Data

  67268-5962-88735/tx/ government standard

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Maximum Power Dissipation Rating

  1.0 milliwatts

• Inclosure Material

  ceramic

• Terminal Surface Treatment

  solder

• Time Rating Per Chacteristic

  25.00 nanoseconds nominal access

• Part Name Assigned By Controlling Agency

  microcircuit,digital fused prom

• Voltage Rating And Type Per Characteristic

  -0.5 volts minimum absolute input and 7.0 volts maximum absolute input

• Terminal Type And Quantity

  24 printed circuit

• End Item Identification

  an/gpn-22&tpn e/i fscm 49956