MSM832FUMB-45

Technical Characteristics

• Body Width

  0.360 inches minimum and 0.380 inches maximum

• Body Height

  0.070 inches minimum and 0.090 inches maximum

• Operating Temp Range

  -55.0 to 125.0 deg celsius

• Iii End Item Identification

  weapon system processor,lgm030g

• Inclosure Material

  ceramic

• Inclosure Configuration

  flat pack

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• (Non-Core Data) Bit Quantity

  262144

• Criticality Code Justification

  feat

• (Non-Core Data) Word Quantity

  32768

• Case Outline Source And Designator

  f-11 mil-m-38510

• Terminal Surface Treatment

  solder

• Part Name Assigned By Controlling Agency

  microcircuit,digital,256k (32k x 8) static random access memory

• Voltage Rating And Type Per Characteristic

  4.5 volts minimum total supply and 5.5 volts maximum total supply

• Time Rating Per Chacteristic

  45.00 nanoseconds nominal access

• Special Features

  esd;hci;item 92696/edi8834ca45fm (cypress die),0dwh9/msm832fumb-45 (sony die) and 65786/cy7c199-45kmb (which is 67268/5962-8866204ma or 81349/m38510/29308bma) were tested and met the hci criteria

• Mfr Source Controlling Reference

  g405217-6

• Terminal Type And Quantity

  28 flat leads

• Body Length

  0.720 inches minimum and 0.740 inches maximum

• Maximum Power Dissipation Rating

  1.0 watts

• Storage Temp Range

  -65.0 to 150.0 deg celsius

• Features Provided

  static operation and monolithic and electrostatic sensitive and burn in, mil-std-883, class b and radiation hardened and tested to mil-std-883

• Memory Device Type

  ram

• Manufacturers Code

  3b150

• Test Data Document

  96906-mil-std-883 standard