ROM/PROM

Technical Characteristics

• Maximum Power Dissipation Rating

  450.0 milliwatts

• Features Provided

  monolithic and hermetically sealed and programmed

• Inclosure Material

  ceramic

• Current Rating Per Characteristic

  100.00 milliamperes maximum forward

• Test Data Document

  96906-mil-std-883 standard

• Terminal Type And Quantity

  14 printed circuit

• Body Height

  0.193 inches maximum

• Body Length

  0.660 inches minimum and 0.785 inches maximum

• Memory Device Type

  diode matrix

• Voltage Rating And Type Per Characteristic

  5.0 volts nominal reference

• Terminal Surface Treatment

  solder

• Bit Quantity

  40

• Output Logic Form

  transistor-transistor logic

• Inclosure Configuration

  dual-in-line

• Storage Temp Range

  -65.0 to 150.0 deg celsius

• Operating Temp Range

  -55.0 to 125.0 deg celsius

• Body Width

  0.230 inches minimum and 0.290 inches maximum