ROM/PROM

Microcircuits, Electronic

MICROCIRCUIT,MEMORY

ROM/PROM

5962-01-376-1634

5962 - Microcircuits, Electronic

Defense Electronics Supply Center

MICROCIRCUIT,MEMORY

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Technical Characteristics

  • Test Data Document

    96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

  • Storage Temp Range

    -65.0/+150.0 deg celsius

  • Features Provided

    w/disable and bidirectional and 3-state output and programmed and w/enable and high impedance and w/clock and bipolar and electrostatic sensitive

  • Inclosure Configuration

    leadless flat pack

  • Inclosure Material

    ceramic

  • Terminal Surface Treatment

    solder

  • Input Circuit Pattern

    12 input

  • Current Rating Per Characteristic

    1.00 milliamperes reverse current, dc microamperes

  • Case Outline Source And Designator

    c-2 mil-m-38510

  • Time Rating Per Chacteristic

    20.00 nanoseconds maximum propagation delay time, high to low level output and 20.00 nanoseconds maximum propagation delay time, low to high level output

  • Body Length

    0.342 inches minimum and 0.358 inches maximum

  • Output Logic Form

    transistor-transistor logic

  • Body Height

    0.060 inches minimum and 0.100 inches maximum

  • Operating Temp Range

    -55.0/+125.0 deg celsius

  • Memory Device Type

    pal

  • Body Width

    0.342 inches minimum and 0.358 inches maximum

  • Part Name Assigned By Controlling Agency

    registered and-or gate array - pal cpu control

  • Voltage Rating And Type Per Characteristic

    -0.5 volts minimum power source and 7.0 volts maximum power source

  • Maximum Power Dissipation Rating

    1.1 watts

  • Terminal Type And Quantity

    20 leadless

Certified to
AS6081 Methods

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