3030-70MB4

Technical Characteristics

• Operating Temp Range

  -20.0/+125.0 deg celsius

• Body Height

  0.100 inches minimum and 0.150 inches maximum

• Memory Device Type

  pal

• Features Provided

  electrostatic sensitive and programmed

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Body Width

  1.340 inches minimum and 1.380 inches maximum

• Terminal Surface Treatment

  solder

• Inclosure Configuration

  pin grid array

• Body Length

  1.340 inches minimum and 1.380 inches maximum

• Inclosure Material

  plastic