X28C256KMB-20

Technical Characteristics

• Test Data Document

  81349-mil-m-38510 specification (includes engineering type bulletins, brochures,etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type

• Maximum Power Dissipation Rating

  1.0 watts

• Terminal Surface Treatment

  solder

• Body Length

  0.640 inches minimum and 0.660 inches maximum

• Inclosure Configuration

  pin grid array

• Memory Device Type

  eeprom

• Nondefinitive Spec/Std Data

  u case and 04 type and a finish

• Voltage Rating And Type Per Characteristic

  -0.3 volts minimum absolute input and 6.25 volts maximum absolute input

• Current Rating Per Characteristic

  80.00 milliamperes forward current, nonrepetitive, maximum peak total value minor

• ~1

  data on certain environmental and performanc

• End Item Identification

  wgu-2c/b guid e/i fscm 96214

• Specification/Standard Data

  67268-5962-88525 government standard and 96214-2698759-2004 manufacturers specification control

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Bit Quantity (Non-Core)

  262144

• Hybrid Technology Type

  monolithic

• Features Provided

  programmable and tested to mil-std-883

• Word Quantity (Non-Core)

  32768

• Part Name Assigned By Controlling Agency

  32k x 8 eeprom

• Body Height

  0.080 inches minimum and 0.100 inches maximum

• Time Rating Per Chacteristic

  200.00 nanoseconds nominal access and 10.00 milliseconds nominal write-cycle width

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Inclosure Material

  ceramic

• Terminal Type And Quantity

  28 pin