IXTL150/JTX

Technical Characteristics

• Special Test Features

  environmental stress screening

• Voltage Rating In Volts Per Characteristic

  100.0 minimum breakdown voltage, drain-to-source, with all other terminals short-circuited to source and 20.0 maximum gate to source voltage

• Semiconductor Material

  silicon

• Overall Length

  0.790 inches minimum and 0.800 inches maximum

• Mounting Method

  terminal and unthreaded hole

• Overall Width

  0.535 inches minimum and 0.545 inches maximum

• Joint Electronic Device Engineering Council/Jedec/Case Outline Designation

  to-254

• Overall Height

  0.249 inches minimum and 0.260 inches maximum

• Maximum Operating Temp Per Measurement Point

  150.0 deg celsius junction

• Internal Configuration

  field effect

• Inclosure Material

  metal

• Current Rating Per Characteristic

  22.00 amperes source cutoff current maximum of standard range and 88.00 amperes forward current, average any acceptable

• Power Rating Per Characteristic

  125.0 watts small-signal input power, common-collector absolute

• Test Data Document

  08748-tr162 drawing (this is the basic governing drawing, such as a contractor drawing, original equipment manufacturer drawing, etc.; excludes any specification, standard or other document that may be referenced in a basic governing drawing) and

• Terminal Type And Quantity

  3 uninsulated wire lead

• Mounting Facility Quantity

  1

• Channel Polarity And Control Type (Non-Core)

  n-channel insulated gate type

• ~1

  08748-tr169 drawing (this is the basic governing draw