HSMS-2802

Semiconductor Devices and Associated Hardware

SEMICONDUCTOR DEVICE,DIODE

HSMS-2802

5961-01-384-4618

5961 - Semiconductor Devices and Associated Hardware

Hewlett-Packard Co

SEMICONDUCTOR DEVICE,DIODE

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Technical Characteristics

  • Special Features

    lead material is alloy 42; lead finish is tin-lead 60-40 percent; max soldering temp 260 degreees celcius for 5 sec; minimum leas strength is 2 lbs pull

  • Part Name Assigned By Controlling Agency

    surface mount rf schottky barrier diodes

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AS6081 Methods

Implementing Quality Procurement

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