HSMS-2802-T31
Semiconductor Devices and Associated Hardware
SEMICONDUCTOR DEVICE,DIODE
HSMS-2802-T31
5961 - Semiconductor Devices and Associated Hardware
SEMICONDUCTOR DEVICE,DIODE
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Technical Characteristics
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Special Features
lead material is alloy 42; lead finish is tin-lead 60-40 percent; max soldering temp 260 degreees celcius for 5 sec; minimum leas strength is 2 lbs pull
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Part Name Assigned By Controlling Agency
surface mount rf schottky barrier diodes