1195-01136-2216

Technical Characteristics

• Temp Coefficient Of Capacitance Per Section In Ppm Per Deg Celsius

  0.0 single section

• Dissipation Factor At Reference Temp In Percent

  2.500

• Body Style

  chip type

• Nonderated Continuous Voltage Rating And Type Per Section

  50.0 dc single section

• Case Material

  ceramic

• Terminal Type And Quantity

  2 bonding pad

• Body Length

  0.126 inches nominal

• Insulation Resistance At Maximum Operating Temp

  100.0 megohms

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  -30.0/+30.0 single section

• Body Height

  0.059 inches nominal

• Terminal Surface Treatment

  solder

• Insulation Resistance At Reference Temp

  1000.0 megohms

• Reliability Indicator

  not established

• Terminal Length

  0.020 inches nominal

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Tolerance Range Per Section

  -10.00/+10.00 percent single section

• Body Width

  0.063 inches nominal

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Capacitance Value Per Section

  220.000 picofarads single section