MIL-C-55681/4

Technical Characteristics

• Reference Temp At Which Rated

  25.0 deg celsius

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Insulation Resistance At Reference Temp

  100000.0 megohms

• Dissipation Factor At Reference Temp In Percent

  0.150

• Body Width

  0.055 inches nominal

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Tolerance Range Per Section

  -2.00/+2.00 percent single section

• Body Length

  0.055 inches nominal

• Reliability Failure Rate Level In Percent

  0.010

• Terminal Surface Treatment

  solder

• Insulation Resistance At Maximum Operating Temp

  1000.0 megohms

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  -30.0/+30.0 single section

• Reliability Indicator

  established

• Body Height

  0.020 inches minimum and 0.057 inches maximum

• Capacitance Value Per Section

  200.000 microfarads single section

• Specification/Standard Data

  81349-mil-c-55681/4 government specification

• Terminal Type And Quantity

  2 bonding pad

• Case Material

  ceramic

• Nonderated Continuous Voltage Rating And Type Per Section

  50.0 dc single section

• Body Style

  chip type

• Temp Coefficient Of Capacitance Per Section In Ppm Per Deg Celsius

  0.0 single section