12101C104KAT9A

Technical Characteristics

• Dissipation Factor At Reference Temp In Percent

  2.500

• Overall Height (Non-Core)

  0.060 inches nominal

• Body Style

  chip type

• Body Width

  0.098 inches nominal

• Case Material

  ceramic

• Body Height

  0.060 inches nominal

• Terminal Type And Quantity

  2 bonding pad

• Overall Length (Non-Core)

  0.126 inches nominal

• Body Length

  0.126 inches nominal

• Nonderated Continuous Voltage Rating And Type Per Section

  100.0 dc single section

• Overall Width (Non-Core)

  0.098 inches nominal

• Voltage Temp Limits Per Section In Percent Capacitance Change

  -15.0/+15.0 with rated voltage applied single section

• Terminal Surface Treatment

  solder

• Reliability Indicator

  not established

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Insulation Resistance At Maximum Operating Temp

  10000.0 megohms

• Tolerance Range Per Section

  -10.00/+10.00 percent single section

• Capacitance Value Per Section

  0.100 microfarads single section

• Terminal Length

  0.010 inches minimum and 0.028 inches maximum

• Insulation Resistance At Reference Temp

  100000.0 megohms

• Schematic Diagram Designator

  no common or grounded electrode(s)