CF68011HFG

Technical Characteristics

• Special Features

  112,000 gate count;ti tbg1000 0.8 micron bi-cmos technology;four functions-bus interface, symbol generator, symbol occlusion and symbol scan conversion functions;max clock frequency is 40 mhz

• Inclosure Configuration

  leaded chip carrier

• Part Name Assigned By Controlling Agency

  microcircuit, asic, digital, symbol generator

• Voltage Rating And Type Per Characteristic

  5.0 volts maximum input and -0.5 volts minimum input and -0.5 volts minimum power source and 6.0 volts maximum power source

• Terminal Type And Quantity

  196 beam lead

• Body Length

  2.540 inches maximum

• Memory Device Type

  pal

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Body Height

  0.103 inches maximum

• Criticality Code Justification

  cbbl

• Output Logic Form

  bipolar metal-oxide semiconductor

• End Item Identification

  f-16

• Features Provided

  bipolar and electrostatic sensitive and hermetically sealed and programmed and burn in, mil-std-883, class b and tested to mil-std-883

• Terminal Surface Treatment

  solder

• Inclosure Material

  ceramic

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Body Width

  2.540 inches maximum

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).