0805CG399C9AP

Technical Characteristics

• Overall Height (Non-Core)

  0.5 millimeters nominal

• Temp Coefficient Of Capacitance Per Section In Ppm Per Deg Celsius

  0.0 single section

• Body Style

  chip type

• Overall Length (Non-Core)

  2.0 millimeters nominal

• Overall Width (Non-Core)

  1.3 millimeters nominal

• Nonderated Continuous Voltage Rating And Type Per Section

  63.0 dc single section

• Terminal Type And Quantity

  2 bonding pad

• Body Width

  1.3 millimeters nominal

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  -30.0/+30.0 single section

• Case Material

  plastic

• Body Length

  2.0 millimeters nominal

• Terminal Surface Treatment

  solder

• Reliability Indicator

  not established

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Terminal Length

  0.8 millimeters nominal

• Capacitance Value Per Section

  3.900 picofarads single section

• Tolerance Range Per Section

  -0.25/+0.25 picofarads single section

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Body Height

  0.5 millimeters nominal