ROM/PROM

Technical Characteristics

• Features Provided

  burn in and monolithic and bidirectional

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Inclosure Material

  ceramic

• Terminal Surface Treatment

  solder

• End Item Identification

  instrument se; fscm 76823

• Nuclear Hardness Critical Feature

  hardened

• Memory Device Type

  pal

• Criticality Code Justification

  feat

• Inclosure Configuration

  flat pack

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Voltage Rating And Type Per Characteristic

  -0.5 volts minimum multiplex input signal and 7.0 volts maximum power source

• Maximum Power Dissipation Rating

  1.5 watts

• Terminal Type And Quantity

  68 pin

• Special Features

  nuclear hardness item