83649-30

Technical Characteristics

• Inclosure Configuration

  leaded chip carrier

• Terminal Type And Quantity

  20 j-hook

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• End Item Identification

  a/f-18-dcn e/i fscm 93322

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Terminal Surface Treatment

  solder

• Maximum Power Dissipation Rating

  500.0 milliwatts

• Design Function And Quantity

  1 buffer

• Special Features

  w/non-inverting 3-state outputs and esd

• Part Name Assigned By Controlling Agency

  ceramic chip carrier assembly, flat j-leaded

• Output Logic Form

  complementary-metal oxide-semiconductor logic and transistor-transistor logic

• Features Provided

  w/clock and monolithic

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Voltage Rating And Type Per Characteristic

  -0.5 volts minimum power source and 7.0 volts maximum power source