TC74HC07AF

Technical Characteristics

• Inclosure Configuration

  leaded chip carrier

• Design Function And Quantity

  1 buffer, hex

• Operating Temp Range

  -40.0/+85.0 deg celsius

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Features Provided

  electrostatic sensitive and low noise

• Terminal Surface Treatment

  solder

• Terminal Type And Quantity

  14 gullwing

• End Item Identification

  general purpose electronic test equipment/end item is 6625-01-425-2551 analyer, spectrum

• Voltage Rating And Type Per Characteristic

  -0.5 volts minimum input and 7.0 volts maximum input

• Inclosure Material

  plastic

• Part Name Assigned By Controlling Agency

  hex buffer (open drain)

• Maximum Power Dissipation Rating

  180.0 milliwatts