ROM/PROM HEAD 273

Technical Characteristics

• Maximum Power Dissipation Rating

  1.5 watts

• Part Name Assigned By Controlling Agency

  microcircuit, memory, digital, cmos, programmable array logic (eepld), monolithic silicon

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Inclosure Configuration

  flat pack

• Memory Device Type

  pal

• Features Provided

  high reliability and low power and erasable and programmable and monolithic

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Time Rating Per Chacteristic

  20.00 nanoseconds af output megawatts

• Voltage Rating And Type Per Characteristic

  -0.5 volts minimum input and 7.0 volts maximum input

• Inclosure Material

  glass and ceramic

• Terminal Type And Quantity

  24 bonding pad

• Special Features

  generic p/n 22v10/22-input, 10 ouyput, eecmos, architecturally generic, programmable and-or array