C0805N471K1GSC

Technical Characteristics

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Dissipation Factor At Reference Temp In Percent

  0.150

• Body Length

  0.070 inches minimum and 0.086 inches maximum

• Precious Material And Location

  bonding pads over electodes silver

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Specification/Standard Data

  81349 - cdr31b+471bfus government specification

• Capacitance Value Per Section

  470.000 picofarads single section

• Reliability Indicator

  established

• Section Quantity

  3

• Nonderated Continuous Voltage Rating And Type Per Section

  100.0 dc single section

• Body Height

  0.020 inches minimum and 0.051 inches maximum

• Reliability Failure Rate Level In Percent

  0.001

• Terminal Length

  0.012 inches minimum and 0.021 inches maximum

• Terminal Type And Quantity

  2 bonding pad

• Body Width

  0.041 inches minimum and 0.057 inches maximum

• Nondefinitive Spec/Std Data

  81349 mil-prf-55681/8 reference number

• Special Features

  base metalization: barrier metal - tinned (tin or tin/lead alloy); solderguard ii

• Case Material

  ceramic

• Tolerance Range Per Section

  -1.00/+1.00 percent single section

• Body Style

  chip type

• End Item Identification

  nsn 4935-01-136-0233; shop equipment, guided missile system; w/s: missile, patroit