ROM/PROM

Technical Characteristics

• Memory Device Type

  first-in first-out

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Inclosure Configuration

  flat pack

• Features Provided

  monolithic and parallel operation

• Memory Capacity

  512 x 9

• Terminal Type And Quantity

  24 flat leads

• Output Logic Form

  complementary-oxidized-silicon logic

• Special Features

  case outline: mil-std-1835, gdfp2-f28

• Body Width

  0.250 inches minimum and 0.370 inches maximum

• Voltage Rating And Type Per Characteristic

  7.0 volts maximum input

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Inclosure Material

  ceramic

• Body Height

  0.045 inches minimum and 0.090 inches maximum

• End Item Identification

  26f aircraft, f-16; 43n aircraft, hornet f/a-18; vun aircraft, hornet f/a-18(e/f); z9n aircraft, fa-18, a-d, e/f, g (growler)

• Time Rating Per Chacteristic

  30.00 nanoseconds nominal access

• Part Name Assigned By Controlling Agency

  microcircuit, memory, digital, cmos, paralel 512 x 9 fifo, monolithic silicon

• Body Length

  0.740 inches maximum