NSN: 5910-01-125-3987

Technical Characteristics

• Terminal Type And Quantity

  2 bonding pad

• Non-Definitive Government Spec/Std Reference

  mil-c-55681/4

• Iii Terminal Surface Treatment

  solder

• Dissipation Factor At Reference Temp In Percent

  0.0500

• Case Material

  glass

• Temp Coefficient Of Capacitance Per Section In Ppm Per Deg Celsius

  90.0 single section

• Iii Insulation Resistance At Maximum Operating Temp

  100000.0 megohms

• Schematic Diagram Designator

  1c no common or grounded electrode(s)

• Center To Center Distance Between Terminals Parallel To Length

  0.035 inches nominal

• Body Height

  0.057 inches maximum

• Body Width

  0.055 inches nominal

• Iii Overall Height

  0.028 inches minimum and

• Iii Overall Length

  0.055 inches nominal

• Reliability Failure Rate Level In Percent

  1.0000

• Reliability Indicator

  established

• Body Style

  45a chip type

• Specification/Standard Data

  81349-mil-c-55681/4 government specification

• Test Data Document

  81349-mil-c-55681 specification

• Manufacturers Code

  81349

• Definitive Government Spec/Std Reference

  cdr12bg1r8absm

• Insulation Resistance At Reference Temp

  1000000.0 megohms

• Case Material

  ceramic or

• Tolerance Range Per Section

  -0.10 to 0.10 picofarads single section

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  -20.0 to 20.0 single section

• Nonderated Continuous Voltage Rating And Type Per Section

  50.0 dc single section

• Nonderated Operating Temp

  -55.0 deg celsius minimum and

• Nonderated Operating Temp

  125.0 deg celsius maximum

• Capacitance Value Per Section

  1.800 picofarads single section

• Body Height

  0.028 inches minimum and

• Body Length

  0.055 inches nominal

• Iii Overall Width

  0.055 inches nominal

• Iii Overall Height

  0.057 inches maximum

• Terminal Length

  0.010 inches nominal