NSN: 5910-01-158-5564

Technical Characteristics

• Terminal Type And Quantity

  2 bonding pad

• Iii Terminal Surface Treatment

  solder

• Insulation Resistance At Reference Temp

  100000.0 megohms

• Nonderated Continuous Voltage Rating And Type Per Section

  100.0 dc single section

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Schematic Diagram Designator

  1c no common or grounded electrode(s)

• Body Height

  0.020 inches minimum and 0.055 inches maximum

• Body Width

  0.050 inches nominal

• (Non-Core Data) Overall Height

  0.020 inches minimum and 0.055 inches maximum

• Terminal Length

  0.010 inches nominal

• Reliability Indicator

  established

• Body Style

  45a chip type

• Test Data Document

  81349-mil-c-55681 specification

• Non-Definitive Government Spec/Std Reference

  mil-c-55681/1

• Manufacturers Code

  81349

• Definitive Government Spec/Std Reference

  cdr01bx391bksr

• Dissipation Factor At Reference Temp In Percent

  2.5000

• Case Material

  ceramic

• Tolerance Range Per Section

  -10.00 to 10.00 percent single section

• Voltage Temp Limits Per Section In Percent Capacitance Change

  -25.0 to 15.0 with rated voltage applied single section

• Capacitance Value Per Section

  390.000 picofarads single section

• Iii Insulation Resistance At Maximum Operating Temp

  10000.0 megohms

• Iii End Item Identification

  central office,telephone,automatic an/ttc-39

• Body Length

  0.080 inches nominal

• (Non-Core Data) Overall Width

  0.050 inches nominal

• (Non-Core Data) Overall Length

  0.080 inches nominal

• Reliability Failure Rate Level In Percent

  0.0100

• Specification/Standard Data

  81349-mil-c-55681/1 government specification