NSN: 5910-01-176-6548

Technical Characteristics

• Case Material

  glass

• Insulation Resistance At Reference Temp

  1000000.0 megohms

• Terminal Surface Treatment

  solder

• Terminal Type And Quantity

  2 bonding pad

• Overall Width

  0.120 inches nominal

• Body Width

  0.120 inches nominal

• Insulation Resistance At Maximum Operating Temp

  100000.0 megohms

• Capacitance Value Per Section

  3.300 picofarads single section

• Nonderated Operating Temp

  m55.0 deg celsius minimum and 125.0 deg celsius maximum

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  m20.0/p20.0 single section

• Body Style

  chip type

• Reliability Indicator

  not established

• Overall Length

  0.120 inches nominal

• Overall Height

  0.100 inches maximum

• Body Length

  0.120 inches nominal

• Body Height

  0.100 inches maximum

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Features Provided

  hermetically sealed case

• Temp Coefficient Of Capacitance Per Section In Ppm Per Deg Celsius

  90.0 single section

• Nonderated Continuous Voltage Rating And Type Per Section

  500.0 dc single section

• Tolerance Range Per Section

  m0.25/p0.25 picofarads single section

• Quality Factor At Reference Temp

  10000.0000